CUPID

VERTICAL PANEL PROCESSING

CUPID VERTICAL PANEL PROCESSING

CUPID VERTICAL PANEL PROCESSING

The CUPID (VHS-P) platform was introduced in 2016 to process panels larger than 300x300mm² in vertical chambers. Where the high -speed plating system allowed us to achieve already superior uniformity and plating speeds on single wafer substrate in a horizontal configuration, the vertical chamber is where this system truly shines.

PLATING ELECTROLYTE

Through careful and uniform injection of the plating electrolyte near the surface and the linearization of the electric field at the same time, it is the only system that makes fine line plating feasible on large / very large substrates.

PHOTORESIST STRIP/DEVELOP AND UBM ETCH

Knowing that plating is just one step in the whole wet process of the panel, we also offer a complete photoresist strip / developer and seed and barrier layer etch program to enable all kinds of RDL (redistribution layer) processes for your packaging needs.

CUPID CUSTOMER ADDED VALUES

The ideal platform for fine-line plating on large substrates up to Gen5.1
Customized to our customer’s needs
Two substrates processed at once per chamber for higher throughput
Full suite of wet processes for RDL packaging applications
Modular platform
Upgrade- and future-proof
Highly innovative new wet processes
Established high-throughput processing chambers

CUPID HIGHLIGHTS

Processing of 300x300mm² up to Gen5.1 substrates
Deposition of extremely uniform metal structures.
Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry
Industry 4.0 ready – control and monitor all process parameters
Plating uniformity 5% or better
Etch uniformity 5% or better
Online dosing system
Online chemical monitoring
Online gas detection for safety
Multipoint end-point detection for many etch processes