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AUTOMATED TRITONFor production purpose -
SEMI-AUTOMATED TRITONFor pilot line purpose
TRITON SINGLE WAFER PLATFORM
TRITON SINGLE WAFER PLATFORM
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes.
The modular build of our tools enables our customer to configure the tool for a mass-production single-process tool as well as a swiss-army knife R&D or prototyping tool – without affecting performance or reliability.
FRAMEWORKS
Within the modular frame-work, we keep innovating the platform.
Our customers can choose to equip their tool with the High-Speed Plating System in favor of a traditional fountain plater, or with an upper chamber that allows pre-wetting as well as a final rinse/dry above the plating chamber without needing a robot move.
FLEXIBILITY
We provide our customers with the most flexibility. Tools can be made ready to support additional chambers and/or tanks, so it will grow with your process needs. Our modular thinking makes it possible that newly developed chambers can be added to existing tools with space for expansion, future-proofing our customer’s investment.
TRITON CUSTOMER ADDED VALUES
- Excellent speed and quality track record
- Custome- and future-proof
- Highly innovized to our customer’s needs
- Possibility of processing more than one substrate size per chamber with minimal or no reconfiguration
- Modular platform
- Upgradative new wet processes
- Established high-throughput processing chambers
TRITON HIGHLIGHTS
- Processing of 3” to 450 mm substrates
- Possibility of processing two to three different substrate sizes with minimal or no reconfiguration – and no requalification of the chamber
- Patented High-Speed Plating for better throughput and better uniformity – without changing the chemistry
- Industry 4.0 ready – control and monitor all process parameters
- Plating uniformity 3% or better
- Etch uniformity 3% or better
- Online dosing system
- Online chemical monitoring
- Online gas detection for safety
- End-point detection for many etch processes
APPLICATIONS
ELECTRO CHEMICAL DEPOSITION
- Cu RDL layer
- Cu tall pillar
- Cu Bumb
- Cu –Ni- SnAg , Cu-SnAg
- Cu- Ni- Au
SURFACE PREPARATION
- UMB etch
- E-less activation and platingResist develop
- Resist strip
- Lift off
- Si etch
- Wafer thinning
- Damage layer removal
- KOH etch
- Seed layer deposition
- Barrier layer deposition
SEMSYSCO HQ.
Europe | Austria | Salzburg
Karolingerstraße 7c
5020 Salzburg
T: +43 662 222 10
F: +43 662 222 180
Mail: office@semsysco.com
