SEMSYSCO HQ
Europe | Austria | Salzburg
Karolingerstrasse 7c
5020 Salzburg
T: +43 662 222 10
F: +43 662 222 180
Mail: office@semsysco.com
TECHNOLOGY
With its innovative processing platforms, SEMSYSCO enables its customers to quickly scale their processes to different substrate sizes, even from horizontal wafer processes to vertical panel processing.
All our products are based on three platforms, Triton for horizontal single wafer processing, VHS-P for vertical panel processing and Galaxy for batch processes.
PRODUCTS
These platforms offer our customers standardized, robust functionality for all their wet processing requirements.
We are offering a high degree of customization to our established standards in order to tailor our products to our customer’s needs.
SEMSYSCO is ready for the Industry 4.0 transformation, enabling the capture and use of all relevant process data and smart process controlling with e.g. end point detection systems.
MARKET
- Advanced Packaging
- PCB Fine Line
- E- WLP DIE First & Die Last
- EMIB Embedded Multi-Die I Bridge
- Automotive
- Power IC
- MEMs
- BEOL
- LED
- III-V
GALAXY
BATCH WAFER PLATFORM
With the Galaxy batch wafer processing, we combined years of experience with batch wafer processing with the cutting edge of process control typically only found on single wafer tools.
TRITON
SINGLE WAFER PLATFORM
From its inception to the first delivery in 2013, the Triton platform was designed to be a stable but modular workhorse for all single-wafer wet-processes.
CUPID (VHS-P)
VERTICAL PANEL PROCESSING
The CUPID (VHS-P) platform was introduced in 2016 to process panels larger than 300x300mm² in vertical chambers.
