With its innovative processing platforms, SEMSYSCO enables its customers to quickly scale their processes to different substrate sizes, even from horizontal wafer processes to vertical panel processing.
These platforms offer our customers standardized, robust functionality for all their wet processing requirements.
We are offering a high degree of customization to our established standards in order to tailor our products to our customer’s needs.
SEMSYSCO is ready for the Industry 4.0 transformation, enabling the capture and use of all relevant process data and smart process controlling with e.g. end point detection systems.
- Advanced Packaging
- PCB Fine Line
- E- WLP DIE First & Die Last
- EMIB Embedded Multi-Die I Bridge
- Power IC
VERTICAL PANEL PROCESSING
Our newest platform was introduced in 2016 to process panels larger than 300x300mm² in vertical chambers.