Appointment of Frank Su

April 01, 2016 Salzburg, Austria – Semiconductor equipment manufacturer Semsysco GmbH ( has announced the appointment of Frank Su to the position of Managing Director Asia.

SEMSYSCO at SEMICON – Taiwan microelectronics manufacturing fair

Semsysco recently participated successfully the Semicon fair in Taiwan. Enclosed you will find some impressions from our booth.

PRESS RELEASE, Moritzburg/Salzburg Jan 21, 2015

Enforced cooperation between Fraunhofer IZM-ASSID and Semsysco in the field of Wafer Processing. At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. The overall goal is to improve the performance and to deal with specific customer requirements of future generations of device nodes.

Grünwald buys controlling stake in SEMSYSCO

SEMSYSCO Semiconductor Systems Corporation GmbH, the Salzburg, Austria, based manufacturer of wet process equipment for the semiconductor industry, announces that as of today Grünwald Equity Group, based in Grünwald, Germany, has acquired a controlling interest in the company from The Thompson Group Inc., Kalispell, Montana (USA).

SEMSYSCO & Atotech Collaboration

SEMSYSCO and Atotech have collaborated to develop and deliver a unique, integrated solution for optimum electroless plating in advanced packaging technologies. Atotech’s proven Xenolyte© product line will be paired with SEMSYSCO’s cutting edge electroless plating system, GALAXY, to deliver an unparalleled pad metallization process which promises high throughput and fine line capability.

Triton A

– Spray Acid Chamber –

:: Clean
:: Metal Etch
:: Oxide Etch
:: Barrier Strip
:: PR Strip (Ozone)
:: Post Ash Clean (Ozone)

Triton S

– Spray Solvent Chamber –

:: PR Strip
:: Flux Strip
:: Poly Removal
:: Metal Lift-off

Triton EDC

– Electro Deposition Chamber –

:: Modern Fountain Plating Cell
:: Cu, Ni, Au, Solders, Alloys
:: Pads, Lines, Pillars, Bumps, etc.
:: Multiple Metal Capability
:: Optional Bath Management

Triton UBM

– UBM Etch Chamber –

:: Modern Fountain Plating Cell
:: End Point Detection
:: Metal and alloy etch
:: Multiple etchants
:: Contact wafer handling (Bernoulli)