Appointment of Frank Su

April 01, 2016 Salzburg, Austria – Semiconductor equipment manufacturer Semsysco GmbH (www.semsysco.com) has announced the appointment of Frank Su to the position of Managing Director Asia.

SEMSYSCO at SEMICON – Taiwan microelectronics manufacturing fair

Semsysco recently participated successfully the Semicon fair in Taiwan. Enclosed you will find some impressions from our booth.

PRESS RELEASE, Moritzburg/Salzburg Jan 21, 2015

Enforced cooperation between Fraunhofer IZM-ASSID and Semsysco in the field of Wafer Processing. At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. The overall goal is to improve the performance and to deal with specific customer requirements of future generations of device nodes.

Grünwald buys controlling stake in SEMSYSCO

SEMSYSCO Semiconductor Systems Corporation GmbH, the Salzburg, Austria, based manufacturer of wet process equipment for the semiconductor industry, announces that as of today Grünwald Equity Group, based in Grünwald, Germany, has acquired a controlling interest in the company from The Thompson Group Inc., Kalispell, Montana (USA).

SEMSYSCO & Atotech Collaboration

SEMSYSCO and Atotech have collaborated to develop and deliver a unique, integrated solution for optimum electroless plating in advanced packaging technologies. Atotech’s proven Xenolyte© product line will be paired with SEMSYSCO’s cutting edge electroless plating system, GALAXY, to deliver an unparalleled pad metallization process which promises high throughput and fine line capability.

Stellar

Automated / Semi automated / Manual

About

The SEMSYSCO Stellar Batch Processing System is a highly space-efficient, highly modifiable acid, solvent, and ozone processing platform. The batch process chambers utilize on-axis spray technology to provide unmatched process efficiency and uniformity results. The process modules offer high throughput in a small footprint, simple operator controls and reliable design. The Stellar Batch Processing System provides low cost of ownership through its small footprint, low maintenance requirements and completely self-contained design. The platform can be configured with multiple process chambers to meet any capacity requirement.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Configurations

The platform can be configured with multiple process chambers covering etch, clean and stripping processes in one system.

The SAP (Spray Acid Processor) Process Chamber is contained in a powder-coated stainless steel cabinet in which all fluid handling components, tanks, pumps, valves and plumbing are contained. Panelling is made from PP sheeting, FM4910 material is also an option. All fluid control components, electrical and mechanical, are contained in the module. Multiple SAP chamber systems are configurable to execute an extended process integration sequence or can simply be equipped with multiple duplicate chambers for high volume production.

The SSP (Spray Solvent Processor) Process Chamber is contained in a stainless steel cabinet in which all fluid handling components, tanks, pumps, valves and plumbing are contained. All fluid control components, electrical and mechanical, are contained in the module. Multiple chamber systems are available.

The SOP (Spray Ozone Processor) Process Chamber is contained in a powder-coated stainless steel cabinet in which all fluid handling components, tanks, pumps, valves and plumbing are contained. Panelling is made from PP sheeting, FM4910 material is also an option. All fluid control components, electrical and mechanical, are contained in the module. Internal ozone generators are optional, external generators are standard.

Benefits

The fully automated Stellar Batch Processing System utilizes on-axis spray technology to provide unmatched process efficiency and uniformity results. The process modules offer high throughput in a small footprint, simple operator controls and reliable design. Spray technology reduces the amount of required DIW consumption by as much as 80% compared to standard processing. Due to its high level of configuration flexibility, the Stellar can be tailored to nearly any application. The Stellar Batch Processing System provides low cost of ownership through its small footprint, low maintenance requirements and completely self-contained design. The platform can be configured with multiple process chambers to meet any capacity requirement.

Features

:: Multi Process Capability
:: Full Automation if required
:: 150/200/300mm Process capability within one system
:: 25 & 50 Wafer Process Batch Sizes
:: Advanced Data Logging and Viewing
:: Etch Uniformity Performance <5%
:: Industry leading DIW consumption

Typical Reference Process Times

10um Metal Etch, Rinse & Dry 15 min
DHF / SC1 Clean 20 min
PR Strip Solvent 30 min
PR Strip Ozone 30 min

Capacity & Wafer Load Conditions

25-wafer 50-wafer 75-wafer
Metal Etch 100
2k
60k
200
4k
120k
300
6k
180k
WPH
WPD
WPM
DHF / SC1 75
1500
45k
150
3k
90k
225
4.5k
135k
WPH
WPD
WPM
PR Strip 50
1000
30k
100
2k
60k
150
3k
90k
WPH
WPD
WPM

@ 20 hrs per day, 30 days per month