Optimized Electroless Plating with Xenolyte Chemistry and Galaxy EL System
Atotech and SEMSYSCO Collaboration
Atotech and SEMSYSCO have collaborated to develop and deliver a unique, integrated solution for optimum electroless plating in advanced packaging technologies. Atotech’s proven Xenolyte product line will be paired with SEMSYSCO’s cutting edge electroless plating system, Galaxy EL, to deliver an unparalleled pad metallization process which promises high throughput and fine line capability.
:: Spray batch pretreatment :: Electroless plating of Ni, Pd, Au in wet bench system :: Rinsing and drying in a dedicated chamber
Features and Benefits
:: High throughput paired with exceptional fine line plating :: Immersion and spray plating capabilities in one system :: Fully automated with easy maintenance :: Stable, cost effective technology
Automation Layout of Galaxy EL System for Electroless Deposition of Ni, Pd, Au