Appointment of Frank Su

April 01, 2016 Salzburg, Austria – Semiconductor equipment manufacturer Semsysco GmbH (www.semsysco.com) has announced the appointment of Frank Su to the position of Managing Director Asia.

SEMSYSCO at SEMICON – Taiwan microelectronics manufacturing fair

Semsysco recently participated successfully the Semicon fair in Taiwan. Enclosed you will find some impressions from our booth.

PRESS RELEASE, Moritzburg/Salzburg Jan 21, 2015

Enforced cooperation between Fraunhofer IZM-ASSID and Semsysco in the field of Wafer Processing. At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. The overall goal is to improve the performance and to deal with specific customer requirements of future generations of device nodes.

Grünwald buys controlling stake in SEMSYSCO

SEMSYSCO Semiconductor Systems Corporation GmbH, the Salzburg, Austria, based manufacturer of wet process equipment for the semiconductor industry, announces that as of today Grünwald Equity Group, based in Grünwald, Germany, has acquired a controlling interest in the company from The Thompson Group Inc., Kalispell, Montana (USA).

SEMSYSCO & Atotech Collaboration

SEMSYSCO and Atotech have collaborated to develop and deliver a unique, integrated solution for optimum electroless plating in advanced packaging technologies. Atotech’s proven Xenolyte© product line will be paired with SEMSYSCO’s cutting edge electroless plating system, GALAXY, to deliver an unparalleled pad metallization process which promises high throughput and fine line capability.

Optimized Electroless Plating with Xenolyte Chemistry and Galaxy EL System

Atotech and SEMSYSCO Collaboration

Atotech and SEMSYSCO have collaborated to develop and deliver a unique, integrated solution for optimum electroless plating in advanced packaging technologies. Atotech’s proven Xenolyte product line will be paired with SEMSYSCO’s cutting edge electroless plating system, Galaxy EL, to deliver an unparalleled pad metallization process which promises high throughput and fine line capability.

The Process

:: Spray batch pretreatment :: Electroless plating of Ni, Pd, Au in wet bench system :: Rinsing and drying in a dedicated chamber

Features and Benefits

:: High throughput paired with exceptional fine line plating :: Immersion and spray plating capabilities in one system :: Fully automated with easy maintenance :: Stable, cost effective technology

Automation Layout of Galaxy EL System for Electroless Deposition of Ni, Pd, Au