Appointment of Frank Su

April 01, 2016 Salzburg, Austria – Semiconductor equipment manufacturer Semsysco GmbH (www.semsysco.com) has announced the appointment of Frank Su to the position of Managing Director Asia. “It gives me great pleasure to announce the addition of Frank Su to the role of Managing director, Asia Region.,” said Herbert Oetzlinger, CEO of Semsysco GmbH. “Over the past 20 years, Frank worked for several of the top OEMs in our industry, including Applied Materials, Semitool, Cymer, FEI and Nikon. With his exceptional experience and focus on total customer satisfaction, we are excited about the results he will bring to Semsysco. Frank’s strategic vision, professionalism, and leadership make him the perfect person to lead our company’s next phase of growth in this region.” “In his role, Frank will lead the Sales team, but he will also take over Service, Customer Support, and all other aspects of Semsysco’s corporate development in that region. Certainly, the future will likely include infrastructure build out, more localized Operations, and strategic partnerships.” Prior to join Semsysco, Frank has built out the Sales Department and refined the sales strategy of previous company in the Asia Region over the past several years. This includes the high growth markets of Taiwan, China, Singapore, Malaysia and Korea. He holds an MS degree in Business administration from National Tsing-Hwa university and a BS in Civil engineering from Feng-Chia...

PRESS RELEASE, Moritzburg/Salzburg Jan 21, 2015

Enforced cooperation  between Fraunhofer IZM-ASSID and Semsysco in the field of Wafer Processing Moritzburg/Salzburg  Jan 21, 2015 At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. The overall goal is to improve the performance and to deal with specific customer requirements of future generations of device nodes. Special research and investigation topics hereby are: UBM wet etching for high density bump Wet cleaning High-speed Cu-pillar plating High-speed TSV metal filling by advanced electrochemical deposition processes, including chamber improvement and new electrolytes in cooperation with supplier Electroless deposition of barrier seed for high aspect ratio TSVs Wet cleaning of TSV M. Juergen Wolf, Head of IZM-ASSID says: „This close cooperation with Semsysco –  as an leading equipment supplier  –  in combination with process and material development is an important step to satisfy  technical requirement and  to deal with optimized  high yield, cost effective processes  which are immediately  provided to customers. Herbert Oetzlinger, CEO of SEMSYSCO GMBH states: ” Fraunhofer IZM-ASSID is a great partner for SEMSYSCO due to the highly competent and innovative staff. The close cooperation enables us to develop and prove innovative product process solutions under fully integrated process flows to meet the growing 2.5D and 3D market...

Grünwald buys controlling stake in SEMSYSCO

Salzburg/Grünwald/Kalispell July 1, 2014 SEMSYSCO Semiconductor Systems Corporation GmbH, the Salzburg, Austria, based manufacturer of wet process equipment for the semiconductor industry, announces that as of today Grünwald Equity Group, based in Grünwald, Germany, has acquired a controlling interest in the company from The Thompson Group Inc., Kalispell, Montana (USA) Herbert Ötzlinger, CEO and shareholder of SEMSYSCO GmbH, comments: “The investment by Grünwald Equity secures the company’s access to capital for supporting the growth of the existing portfolio as well as the planned expansion of products in the fields of Advanced Packaging and Automotive Power Semiconductor Applications. This expansion will take place in the spirit of the company’s founder, Mr. Ray Thompson, who enjoys worldwide recognition for developing innovative equipment and process solutions for the semiconductor industry.” Max Graf von Moy, Managing Partner of Grünwald Equity, comments: “In the recent months we have been impressed both by the highly customer oriented approach of Semsysco and the responsive time-to-market for the company’s products.” About SEMSYSCO Salzburg: Semsysco designs, manufactures and supports highly engineered equipment for single-wafer and batch wet chemical processing used in the fabrication of semiconductor devices. The company’s primary suites of equipment include surface preparation systems for cleaning, stripping and etching, electrochemical and electroless plating for copper, gold, solder and other metals. The company’s equipment is used in semiconductor fabrication front-end and back-end processes, with a heavy focus on advanced wafer-level packaging. Headquartered in Salzburg, Austria, Semsysco maintains sales and support centers in Europe, Asia and US. For more information, please visit www.semsysco.com About Grünwald Equity: Grünwald Equity is a group of long term equity investors with comprehensive...

SEMSYSCO & Atotech Collaboration

SEMSYSCO and Atotech have collaborated to develop and deliver a unique, integrated solution for optimum electroless plating in advanced packaging technologies. Atotech’s proven Xenolyte© product line will be paired with SEMSYSCO’s cutting edge electroless plating system, GALAXY, to deliver an unparalleled pad metallization process which promises high throughput and fine line capability. The goal of the cooperation is to combine the best of two production methods – the high throughput achieved with wet bench plating and the successful plating of fine lines typically achieved in a batch spray tool. This leading edge technology will encompass a spray batch pretreatment, followed by the electroless plating of nickel, palladium and (if needed) immersion gold in a wet bench system with Atotech proven design and technology. The final rinsing and drying will take place in a designated Spin Rinse Dryer (SRD) chamber. The ancosys ancolyzer on-line system will be used for monitoring and dosing the plating bath compounds. The system will be fully automated and will be optimized for easy maintenance and cleaning. Herbert Oetzlinger, CEO of SEMSYSCO said of the partnership, “We are extremely pleased to be working with Atotech on the electroless project; it will enable us to bring to the market quickly a challenging process that is more stable and cost effective than existing tool/process combinations. The use of both immersion and kinetic spray systems in one tool coupled with the experience of both companies’ personnel ensures a short time to market of a fully automatic, high throughput system.” Optimal Electroless Plating for All Applications Atotech’s Xenolyte© product line is used for the electroless deposition of nickel, palladium and...