PRESS RELEASE, Moritzburg/Salzburg Jan 21, 2015

Enforced cooperation  between Fraunhofer IZM-ASSID and Semsysco in the field of Wafer Processing Moritzburg/Salzburg  Jan 21, 2015 At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. The overall goal is to improve the performance and to deal with specific customer requirements of future generations of device nodes. Special research and investigation topics hereby are: UBM wet etching for high density bump Wet cleaning High-speed Cu-pillar plating High-speed TSV metal filling by advanced electrochemical deposition processes, including chamber improvement and new electrolytes in cooperation with supplier Electroless deposition of barrier seed for high aspect ratio TSVs Wet cleaning of TSV M. Juergen Wolf, Head of IZM-ASSID says: „This close cooperation with Semsysco –  as an leading equipment supplier  –  in combination with process and material development is an important step to satisfy  technical requirement and  to deal with optimized  high yield, cost effective processes  which are immediately  provided to customers. Herbert Oetzlinger, CEO of SEMSYSCO GMBH states: ” Fraunhofer IZM-ASSID is a great partner for SEMSYSCO due to the highly competent and innovative staff. The close cooperation enables us to develop and prove innovative product process solutions under fully integrated process flows to meet the growing 2.5D and 3D market...

Grünwald buys controlling stake in SEMSYSCO

Salzburg/Grünwald/Kalispell July 1, 2014 SEMSYSCO Semiconductor Systems Corporation GmbH, the Salzburg, Austria, based manufacturer of wet process equipment for the semiconductor industry, announces that as of today Grünwald Equity Group, based in Grünwald, Germany, has acquired a controlling interest in the company from The Thompson Group Inc., Kalispell, Montana (USA) Herbert Ötzlinger, CEO and shareholder of SEMSYSCO GmbH, comments: “The investment by Grünwald Equity secures the company’s access to capital for supporting the growth of the existing portfolio as well as the planned expansion of products in the fields of Advanced Packaging and Automotive Power Semiconductor Applications. This expansion will take place in the spirit of the company’s founder, Mr. Ray Thompson, who enjoys worldwide recognition for developing innovative equipment and process solutions for the semiconductor industry.” Max Graf von Moy, Managing Partner of Grünwald Equity, comments: “In the recent months we have been impressed both by the highly customer oriented approach of Semsysco and the responsive time-to-market for the company’s products.” About SEMSYSCO Salzburg: Semsysco designs, manufactures and supports highly engineered equipment for single-wafer and batch wet chemical processing used in the fabrication of semiconductor devices. The company’s primary suites of equipment include surface preparation systems for cleaning, stripping and etching, electrochemical and electroless plating for copper, gold, solder and other metals. The company’s equipment is used in semiconductor fabrication front-end and back-end processes, with a heavy focus on advanced wafer-level packaging. Headquartered in Salzburg, Austria, Semsysco maintains sales and support centers in Europe, Asia and US. For more information, please visit www.semsysco.com About Grünwald Equity: Grünwald Equity is a group of long term equity investors with comprehensive...