Enforced cooperation between Fraunhofer IZM-ASSID and Semsysco in the field of Wafer Processing
Moritzburg/Salzburg Jan 21, 2015
At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning.
At the European 3D IC Summit Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) and SEMSYSCO Salzburg are announcing to enforce their cooperation in the field of wafer processing for wet etch, ECD and wet cleaning. The overall goal is to improve the performance and to deal with specific customer requirements of future generations of device nodes. Special research and investigation topics hereby are:
- UBM wet etching for high density bump
- Wet cleaning
- High-speed Cu-pillar plating
- High-speed TSV metal filling by advanced electrochemical deposition processes, including chamber improvement and new electrolytes in cooperation with supplier
- Electroless deposition of barrier seed for high aspect ratio TSVs
- Wet cleaning of TSV
M. Juergen Wolf, Head of IZM-ASSID says: „This close cooperation with Semsysco – as an leading equipment supplier – in combination with process and material development is an important step to satisfy technical requirement and to deal with optimized high yield, cost effective processes which are immediately provided to customers.
Herbert Oetzlinger, CEO of SEMSYSCO GMBH states: ” Fraunhofer IZM-ASSID is a great partner for SEMSYSCO due to the highly competent and innovative staff. The close cooperation enables us to develop and prove innovative product process solutions under fully integrated process flows to meet the growing 2.5D and 3D market demands.